0.4 mm Tin BGA Reballing Soldering Balls for BGA Rework Repair Tool

SKU RTL-199

₹140.00 +GST

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The delivery time will depend on the product availability as well as your location. Pan India delivery will take around 3 to 4 days.

We do not offer any returns. If you genuinely have received a faulty product, please contact us.

Description

0.4 mm Tin BGA Reballing Soldering Balls for BGA Rework Repair Tool

RTL-199

Balls alloy: Sn63/Pb37

Melting point: 183°C

Each Bottle Contains About 25000 Solder Balls

Working temperature: 200-380°C

Melting point: 183°C

Flux content: 63%

 

Additional Information

Weight 4.51 g

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Categories: SKU: RTL-199