0.6 mm Universal Tin Solder Balls for BGA Reballing and Soldering 2.5w

SKU RTL-200

180.00 +GST

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The delivery time will depend on the product availability as well as your location. Pan India delivery will take around 3 to 4 days.

We do not offer any returns. If you genuinely have received a faulty product, please contact us.

Description

0.6 mm Universal Tin Solder Balls for BGA Reballing and Soldering 2.5w

RTL-200

High-quality tin solder balls for soldering work

Used for connection of semiconductor chips, circuit modules, and PCB boards

 

Additional Information

Weight 21.95 g