Description
0.2 mm Tin BGA Reballing Soldering Balls for BGA Rework Repair Tool
RTL-238
Balls alloy: Sn63/Pb37
Melting point: 183°C
Each Bottle Contains About 25000 Solder Balls
Working temperature: 200-380°C
Melting point: 183°C
Flux content: 63%
Additional Information
Weight | 2.48 g |
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