0.25mm Universal Tin Solder Balls for BGA Reballing and Soldering 2.5W (BGA Rework Solder Balls)

0.25mm Universal Tin Solder Balls are precision-sized solder balls designed for BGA reballing, soldering, and electronic component repair. These fine solder balls are suitable for restoring solder connections on BGA packages and are useful for precision PCB rework applications.

Key Features -

• 0.25mm diameter for fine-pitch BGA reballing

• Made from tin solder material

• Designed for BGA reballing and soldering applications

• Suitable for precision electronic component repair

• Compatible with BGA reballing stencils

• Helps restore damaged or missing BGA solder joints

• Suitable for motherboard and PCB repair applications

Specifications -

• Product Type: BGA Reballing Solder Balls

• Material: Tin

• Solder Ball Diameter: 0.25mm

• Power Rating: 2.5W

• Application: BGA Reballing and Soldering

• Type: Universal

• Usage: BGA Rework and PCB Repair

Applications -

• Fine-pitch BGA chip reballing

• Motherboard and PCB repair

• Laptop and computer motherboard repair

• Mobile phone and tablet repair

• Electronic component rework

• Replacement of damaged or missing BGA solder balls

• Precision BGA soldering and rework