0.3mm Tin BGA Reballing Solder Balls (BGA Rework and Soldering Repair Balls)

0.3mm Tin BGA Reballing Solder Balls are precision-sized solder balls designed for fine-pitch BGA reballing, soldering, and electronic component repair. They are suitable for restoring solder connections on BGA packages during PCB rework and repair applications.

Key Features -

• 0.3mm diameter for fine-pitch BGA reballing

• Made from tin solder material

• Designed for BGA reballing and soldering applications

• Suitable for precision electronic component repair

• Compatible with suitable BGA reballing stencils

• Helps restore damaged or missing BGA solder joints

• Suitable for motherboard, PCB, and electronic equipment repair

Specifications -

• Product Type: BGA Reballing Solder Balls

• Material: Tin

• Solder Ball Diameter: 0.3mm

• Application: BGA Reballing and Soldering

• Type: Fine-Pitch Solder Balls

• Usage: BGA Rework and PCB Repair

Applications -

• Fine-pitch BGA chip reballing

• Mobile phone motherboard repair

• Laptop and computer motherboard repair

• PCB rework and repair

• Electronic component reballing

• Replacement of damaged or missing BGA solder balls

• Precision BGA soldering and rework