Board-Level Stamped Aluminium Heatsink (25mm x 22mm PCB Cooling Fin for TO-220 Devices)

The 25mm x 22mm Board-Level Stamped Aluminium Heatsink is designed to dissipate heat from compatible PCB-mounted power components, including TO-220 transistors, MOSFETs, and voltage regulators. Its stamped aluminium construction provides a compact, lightweight thermal management solution for electronic assemblies. The heatsink supports passive air cooling, with performance depending on its geometry, mounting arrangement, and operating conditions.

Key Features -

• Board-level stamped heatsink design

• Compact dimensions of 25mm x 22mm

• Designed for compatible TO-220 package devices

• Aluminium construction for heat transfer

• Lightweight design for PCB-level thermal management

• Passive air cooling without a fan

• Suitable for compatible power electronic assemblies

Specifications -

• Product Type: Board-Level Stamped Heatsink

• Dimensions: 25mm x 22mm

• Material: Stamped aluminium, as specified

• Package Compatibility: TO-220 type, subject to mounting dimensions

• Mounting Method: Depends on the heatsink design; verify clip, pin, or solder mounting

• Cooling Method: Passive air cooling

• Surface Finish: Depends on the product variant

• Thermal Resistance: Refer to manufacturer datasheet

Applications -

• TO-220 transistors and MOSFETs

• Voltage regulator ICs

• Power supply and switched-mode power supply circuits

• PCB-mounted power electronics

• Embedded electronic systems

• Industrial control boards