BOND Liquid Flux for Soldering and Desoldering No Clean 500ml (PCB Soldering Flux)

BOND Liquid Flux is a no-clean soldering flux designed for soldering and desoldering applications. It helps improve solder flow and wetting while reducing surface oxidation, making it suitable for PCB assembly, electronics repair, component replacement, and rework.

Key Features -

• BOND liquid soldering flux

• No-clean flux formulation

• Suitable for soldering and desoldering

• Helps improve solder wetting and flow

• Helps remove surface oxides during soldering

• Suitable for PCB assembly and electronics repair

• Useful for component replacement and rework

• 500ml quantity suitable for regular and high-volume use

Specifications -

• Brand: BOND

• Product Type: Liquid Soldering Flux

• Flux Type: No Clean

• Form: Liquid

• Quantity: 500ml

• Application: Soldering and desoldering

• Suitable For: PCBs, electronic components, wires and terminals

Applications -

• PCB soldering and repair

• SMD component soldering

• Through-hole component soldering

• Desoldering and component removal

• Electronics rework and maintenance

• Mobile and electronic device repair

• Wire and terminal soldering

• Production and workshop soldering