OTS-2034-0.65-01 Enplas IC Test And Burn In Socket TSSOP8 To DIP Programming Adapter
The OTS-2034-0.65-01 Enplas IC Test and Burn In Socket is a programming adapter designed for testing and programming TSSOP8 or SSOP8 packaged integrated circuits. It converts the 0.65mm pitch surface mount package into a DIP format allowing easy connection to programming boards and test fixtures.
This adapter is commonly used in IC programming development laboratories and production testing environments. The high precision contact mechanism ensures reliable electrical connection during programming and repeated test cycles. Its durable construction supports long mechanical life and stable performance for repeated IC insertion and removal.
Key Features
- TSSOP8 or SSOP8 to DIP programming adapter
- Supports 0.65mm pitch IC packages
- Suitable for IC testing and burn in applications
- High precision contact mechanism for stable connection
- Durable design with long mechanical life
- Compatible with programming and test sockets
- Reliable performance for laboratory and production use
Specifications
- Model = OTS-2034-0.65-01
- Package Support = TSSOP8 or SSOP8
- Pin Pitch = 0.65 mm
- Package Size = 4.4 x 6.4 mm
- Insulation Resistance = 1000M ohm minimum at DC 500V
- Dielectric Withstanding Voltage = AC 500V for 1 minute
- Contact Force = 0.5 kg for 1 minute
- Contact Resistance = 50 milli ohm maximum at 10mA initial
- Mechanical Life = 10000 cycles
- Operating Temperature = -65 C to +150 C
Interfaces
- TSSOP8 Socket = IC insertion interface
- DIP8 Pins = Connection to programmer or test board
- Pin1 = IC pin 1 connection
- Pin2 = IC pin 2 connection
- Pin3 = IC pin 3 connection
- Pin4 = IC pin 4 connection
- Pin5 = IC pin 5 connection
- Pin6 = IC pin 6 connection
- Pin7 = IC pin 7 connection
- Pin8 = IC pin 8 connection
